IPO Details
Bidding Dates
26 Sept 24 - 30 Sept 24
Price Range ₹
269 - 283
Total Equity
₹ 186.16Cr
Lot Size
400
Exchange Status
NSE
IPO Doc
Subscription Rate
Non-Institutional Investor
0.00×
Qualified Institutional Buyers
0.00×
Employees
0.00×
Retail Investors
0.00×
Total subscription Rate
0.00×
IPO Timeline
Offer start
26 Sept 2024
Offer end
30 Sept 2024
Allotment
01 Oct 2024
Refund initiation
03 Oct 2024
Demat transfer
03 Oct 2024
Listing
04 Oct 2024
Offer start
26 Sept 2024
Offer end
30 Sept 2024
Allotment
01 Oct 2024
Refund initiation
03 Oct 2024
Demat transfer
03 Oct 2024
Listing
04 Oct 2024
About Company
Founded: February 2023 Business: Electronic System Design and Manufacturing (ESDM) Products & Services: * Printed Circuit Board (PCB) Assembly * Box Build Assembly * LED Lighting Solutions * Computer & IT Accessories (memory, motherboards, etc.) * Design Solutions Market Focus: Global exports (over 80%) to various countries like USA, Rwanda, UK, Germany, etc. Manufacturing Capacity: 1.8 million units through EN 9100:2018 certified plant in Noida (special economic zone with tax benefits). Competitive Strengths: * Diverse product portfolio (PCBAs, box build, LED lighting, IT hardware) * Established global customer base * Quality Management System certification (EN 9100:2018) * Advanced ERP platform * Experienced leadership team with expertise in electronic manufacturing Employees: 160 (as of March 2024)
Year Founded
22-02-2023
Promotor Details
Amrit Lal Manwani
Promoter Holdings Details
| Particular | Pre-IPO | Post-IPO |
|---|---|---|
| Percentage | 95 | 69.9 |
| Share Capital | 17969500 | 17469500 |
Offer to Public
65,78,000.00 Cr
Project Details
- Funding Capital Expenditure towards installation of additional plant and machinery at new - 602.8cr
- Investment in our Subsidiary, Sahasra Semiconductors Private Limited for financing its capital - 254.23cr
Objectives
- Funding Capital Expenditure towards installation of additional plant and machinery at new manufacturing facility situated at Bhiwadi, Rajasthan.Investment in our Subsidiary, Sahasra Semiconductors Private Limited for financing its capital expenditure requirements in relation towards installation of additional plant and machinery.To Meet Working Capital Requirements.General Corporate Purposes.
Highlights
- The company offers dedicated solutions for electronic system design and manufacturing.
- Established relationships with customers across various countries demonstrate a strong market presence.
- The company's manufacturing facility and capabilities provide a solid foundation for operations.
- A commitment to quality assurance ensures customer satisfaction and product reliability.
- The company benefits from experienced promoters, management, and operating teams.
Challenges
- Reliance on a limited number of key customers, including group companies, exposes the company to significant revenue volatility.
- The company's revenue is tied to specific product categories, making it vulnerable to changes in demand or technological advancements.
- Dependence on a recent business takeover, potential supply chain disruptions, and quality control challenges could impact operations.
- Working capital management issues, potential legal liabilities, and regulatory compliance risks could affect the company's financial stability.
- The company's exposure to international trade, potential product warranty claims, and risks associated with its subsidiary's semiconductor business could impact its overall performance.
